Researcher Database

YAMANE DAISUKE

Department / Course College of Science and Engineering Department of Mechanical Engineering

Title / Position Associate Professor

Academic conference presentation
1.	2023/12/12	AN EQUIVALENT CIRCUIT MODEL OF SELF-ASSEMBLED ELECTRET MEMS VIBRATION ENERGY HARVESTERS BASED ON AN ENERGY DIAGRAM IN HARDWARE DESCRIPTION LANGUAGE (The 22nd International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2023))
2.	2023/12/12	INVESTIGATION OF THE RELATIONSHIP BETWEEN SURFACE POTENTIAL AND FILM THICKNESS OF MICRO-PATTERNED SELF-ASSEMBLED ELECTRETS (The 22nd International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2023))
3.	2023/11/17	A Simulation Platform for SAE-MEMS Vibration Energy Harvesters using Hardware Description Language on a Circuit Simulator (36th International Microprocesses and Nanotechnology Conference (MNC2023))
4.	2023/11/17	Enhanced Sensitivity of Modal Interference-Based Strain Sensing Using Micro Dry-Etched Perfluorinated Polymer Optical Fibers (36th International Microprocesses and Nanotechnology Conference (MNC2023))
5.	2023/10/11	SAE-MEMS Technology for Electrostatic Vibrational Energy Harvesters (244th ECS Meeting)
6.	2023/09/19	Evaluation of Micropatterned Self-Assembled Electrets for MEMS Devices (The IEEE 19th International Symposium on Electrets (ISE19))
7.	2023/06/26	CIRCUIT SIMULATOR IMPLEMENTATION OF AN EQUIVALENT CIRCUIT MODEL OF SELF-ASSEMBLED ELECTRET VIBRATIONAL ENERGY HARVESTERS BASED ON AN ENERGY DIAGRAM (The 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2023))
8.	2023/06/26	UNIVERSAL OPTIMIZATION SOLUTION FOR DIELECTRIC GEOMETRY ONSENSITIVITY MAXIMIZATION IN FLEXIBLE CAPACITIVE TACTILE SENSORS (The 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2023))
9.	2023/03/20	Research on MEMS Vibration Energy Harvesters (2nd France-Japan Workshop on Vibration Energy Harvesting)
10.	2023/03/17	Observation of multimodal interference in dry-etched plastic optical fibers (第70回応用物理学会春季学術講演会)
11.	2022/12/14	Direct Measurement of the Surface Potential of Micro-Patterned Self-Assembled Electrets for MEMS Vibrational Energy Harvesters (The 21st International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2022))
12.	2022/11/10	A Simulation Environment for SAE-MEMS Vibration Energy Harvesters using Electric Circuit Simulator (35th International Microprocesses and Nanotechnology Conference (MNC2022))
13.	2022/09/22	A Study on Electrical Characteristics of Self-Assembled Electrets for MEMS Vibration Energy Harvesters (The 83rd JSAP (Japan Society of Applied Physics) Autumn Meeting 2022)
14.	2022/09/22	Development of Vibrational Energy Harvester Based on Smart Mechatronics (The 83rd JSAP (Japan Society of Applied Physics) Autumn Meeting 2022)
15.	2022/09/21	Ultra-High Mechanical Strength and Thermal Stability of Electrodeposited Ni-B Alloys toward MEMS Micro-Components (48th international conference on Micro and Nano Engineering - Eurosensors (MNE-ES))
16.	2022/05/30	A Non-Contact Out-of-Plane Vibratory Energy Harvester with an Electric-Double-Layer Electret (The 10th Asia-Pacific Conference of Transducers and Micro-Nano Technology 2022 (APCOT 2022))
17.	2022/04/14	Smart mechatronics for electrostatic MEMS vibration energy harvesters (The 17th IEEE Int. Conf. on Nano/Micro Engineered and Molecular Systems (IEEE NEMS 2022))
18.	2022/02/10	A Study on a Simulation Platform for SAE-MEMS Energy Harvester
19.	2021/12/08	Demonstration of Non-Contact Type Vibrational Energy Harvester with Electric Double Layer Electrets (The 20th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2021))
20.	2021/09/20	Effect of Current Density on Mechanical Properties of Electrodeposited Gold Evaluated by Micro-Compression Test (Micro and Nano Engineering Conference 2021 (MNE2021))
21.	2021/09/20	Mechanical Property of Gold Micro-Cantilevers for Application in Microelectronics and the Sample Geometry Effect (Micro and Nano Engineering Conference 2021 (MNE2021))
22.	2021/09/20	Micro-Mechanical Characterization of Electrodeposited Ni-Co Alloys toward Design of MEMS Components (Micro and Nano Engineering Conference 2021 (MNE2021))
23.	2021/09/20	Micro-Mechanical Property Evaluation of Gold-Nickel Alloys toward Design of MEMS Components (Micro and Nano Engineering Conference 2021 (MNE2021))
24.	2020/10/04	Effects of Sample Geometry and Grain Size on Mechanical Property of Electrodeposited Gold Evaluated By Micro-Bending Test (PRiME 2020 (ECS, ECSJ, & KECS Joint Meeting))
25.	2020/06	A 100-nG/√Hz-Level Single Au Proof-Mass 3-axis MEMS Accelerometer with Pillar-Shaped Electrodes (Design, Test, Integration & Packaging of MEMS/MOEMS(DTIP2020))
26.	2020/05	Electrodeposition of Au-Cu Alloys and the Micro-Mechanical Properties (237th ECS Meeting with the 18th International Meeting on Chemical Sensors (IMCS 2020))
27.	2020/03	A Gold Proof-Mass Differential MEMS Accelerometer for Micro-G Level Sensing (The 7th IEEE International Symposium on Inertial Sensors & Systems (INERTIAL 2020))
28.	2020/03	Electrodeposited High Strength Au-TiO2 Nano Composite Film for MEMS Devices (第67回応用物理学会春季学術講演会, 13.4 Si系プロセス・Si系薄膜・MEMS・装置技術)
29.	2019/12	Electrodepostion of Au-Cu Alloy Micro-Cantilevers and the Young’s modulus by Resonance Frequency Method (MRS Fall Meeting 2019)
30.	2019/12	Energy Harvesting from Non-Stational Environmental Vibrations using a Voltage-Boost Rectifier Circuit (The 19th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (Power MEMS 2019))
31.	2019/12	Micro-Mechanical Properties of Electrodeposited Au-TiO2 Composite Film (MRS Fall Meeting 2019)
32.	2019/11	Electroplating of Au-Pd Alloy Films and the Mechanical Properties (International Thin Films Conference (TACT 2019))
33.	2019/11	High-Sensitivity Capacitive Tactile Sensor with Vertically Stacked Hollow Structures (The 4th International Symposium on Biomedical Engineering)
34.	2019/11	High-throughput Screening Device for Genes Related to Algal Phototaxis: Parallel Micro-Liquid Handling (The 4th International Symposium on Biomedical Engineering)
35.	2019/10/28	Shock Characteristics of MEMS Inertial Sensors Developed by Ti/Au Multi-Layer Metal Technology (MNC 2019 32nd International Microprocesses and Nanotechnology Conference)
36.	2019/10	Extensive Sensitivity Enhancement in Stacked Capacitive Tactile Sensors (IEEE Sensors 2019)
37.	2019/10	Fabrication of Au-Cu Alloy/Ti Layered Micro-Cantilevers and the Long-Term Structure Stability (IEEE Sensors 2019)
38.	2019/10	High-Sensitivity Inertial Sensor Module to Measure Hidden Micro Muscular Sounds (IEEE Biomedical Circuits and Systems Conference 2019 (BioCAS2019))
39.	2019/10	MEMS Accelerometer Fabricated by Gold Multi-Layer Metal Technology (236th ECS Meeting)
40.	2019/09	Effects of Fixed End Structure on Temperature Dependence of Structure Stability of Ti/Au Micro-Cantilever toward MEMS Applications (45th International Conference on Micro & Nano Engineering (MNE2019))
41.	2019/09	Electrodeposition of TiO2 Nanoparticle Reinforced High Strength Au Film for MEMS Applications (45th International Conference on Micro & Nano Engineering (MNE2019))
42.	2019/09	Fabrication and Evaluation of Au-Cu Alloy 3D Structures toward MEMS Movable Component (45th International Conference on Micro & Nano Engineering (MNE2019))
43.	2019/09	Sample Geometry Effect on Mechanical Property of Electrodeposited Gold Evaluated by Micro-Bending Test (45th International Conference on Micro & Nano Engineering (MNE2019))
44.	2019/06	Bandwidth Enhancement of Vibrational Energy Harvesters by a Voltage-Boost Rectifier Circuit (20th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2019 - EUROSENSORS XXXIII))
45.	2019/05	High Structure Stability Ti/Au Multiple Layer Micro-Cantilever and the Temperature Dependence (The 2nd International Conference on Material Strength and Applied Mechanics (MSAM 2019))
46.	2019/05	Mechanical properties of electrodeposited gold-copper alloy by micro-compression test (The 2nd International Conference on Material Strength and Applied Mechanics (MSAM 2019))
47.	2019/05	Mechanical properties of gold micro-cantilevers with different thickness evaluated by micro-bending test (The 2nd International Conference on Material Strength and Applied Mechanics (MSAM 2019))
48.	2019/05	Pillar-Shaped Electrodes for 3-axis Gold-Proof-Mass MEMS Capacitive Accelerometers (Design, Test, Integration & Packaging of MEMS/MOEMS(DTIP2019))
49.	2019/04	Energy Harvesters for Autonomous Wireless Sensors in True IoT Society
50.	2019/01	A 3-D PARALLEL-PLATE MEMS ACCELEROMETER WITH A GOLD PROOF MASS (32nd IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 2019))
51.	2019/01	A MEMS VIBRATORY ENERGY HARVESTER CHARGED BY AN OFF-CHIP ELECTRET (32nd IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 2019))
52.	2018/12	A Voltage-Boost Rectifier Circuit for Energy Harvesting from Environmental Vibrations (18th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2018))
53.	2018/11	A Sub-1mG Tri-Axis MEMS Accelerometer with Multiple Segmented Capacitance Detection Electrodes (31st International Microprocesses and Nanotechnology Conference (MNC2018))
54.	2018/11	Parallel Manipulation of Small-volume Solutions for Analyzing Phototaxis and Gene Expression of Algae (The 3rd International Symposium on Biomedical Engineering)
55.	2018/11	Sub-1mG MEMS Inertial Sensor for Biomedical Applications (The 20th Takayanagi Kenjiro Memorial Symposium joined with the 4th International Conference on Nano Electronics Research and Education（ICNERE2018）)
56.	2018/11	Vibration Characteristics of a High-Sensitivity Flexible Capacitive Tactile Sensor with Reduced Structural Rigidity (The 3rd International Symposium on Biomedical Engineering)
57.	2018/10	Mechanical Characterization of Constant Current Electroplated Au-Cu Alloy Micro-Cantilever (IUMRS-ICA (19th International Union of Materials Research Societies International Conference in Asia))
58.	2018/10	Mechanical Characterization of Constant Current Electroplated Au-Cu Alloy Micro-Cantilever (IUMRS-ICA (19th International Union of Materials Research Societies International Conference in Asia))
59.	2018/09	Cu-Alloying Effect on Structure Stability of Au Micro-Cantilever (44rd Micro and Nano Engineering (MNE2018))
60.	2018/09	Effects of Ti/Au Layered Structure on Temperature Dependence of Micro-Cantilever Structure Stability (44rd Micro and Nano Engineering (MNE2018))
61.	2018/09	Electrodeposited Au-Cu Alloy with High Yield Stress Evaluated by Micro-Bending Test (44rd Micro and Nano Engineering (MNE2018))
62.	2018/09	Electrodeposition of High Strength Au-Cu Alloys for MEMS Devices (2018 International Conference on Solid State Devices and Materials (SSDM2018))
63.	2018/09	High Strength Electrodeposited Gold-Copper Alloys for MEMS Devices (44rd Micro and Nano Engineering (MNE2018))
64.	2018/09	High-Resolution MEMS Accelerometer by Multi-Layer Metal Technology (Taiwan-Japan-US Joint Workshop on Energy Materials and Sustainable Development)
65.	2018/09	Mechanical Property and Thermal Stability of Electrodeposited Au-Cu Alloys for Reliability of MEMS Devices (44rd Micro and Nano Engineering (MNE2018))
66.	2018/09	Mechanical Strength Enhancement of Ti/Au Layered Structure Evaluated by Micro-Bending Test (44rd Micro and Nano Engineering (MNE2018))
67.	2018/09	Reliability Characteristics of Ti/Au Micro-Cantilever by Long-Term Vibration Test (44rd Micro and Nano Engineering (MNE2018))
68.	2018/09	Young’s Modulus of Ti/Au Micro-Cantilever by Resonance Frequency Method toward Au-Based MEMS Device (44rd Micro and Nano Engineering (MNE2018))
69.	2018/08	CMOS-MEMS accelerometer with gold proof-mass and its application in diagnosis of Parkinsons Disease (4th International Conference on Condensed Matter and Materials Physics)
70.	2018/06	A Study on Effective Young's Modulus of Micro-Cantilevers Fabricated by Au Electroplating (Taiwan-Japan Joint Symposium (co-organized with the 2018 International Conference on Smart Sensors (ICSS 2018))
71.	2018/06	Characteristics of Electroplated Gold Material with Multilayer Metal Technology for CMOS-MEMS Accelerometer (Taiwan-Japan Joint Symposium (co-organized with the 2018 International Conference on Smart Sensors (ICSS 2018))
72.	2018/06	Reliability Evaluation of Au-Cu Microcantilever by Long-Term Vibration Test toward MEMS Components (Taiwan-Japan Joint Symposium (co-organized with the 2018 International Conference on Smart Sensors (ICSS 2018))
73.	2018/06	Structure Stability of Ti/Au Micro-Cantilever Evaluated by Long-Term Vibration Test (Taiwan-Japan Joint Symposium (co-organized with the 2018 International Conference on Smart Sensors (ICSS 2018))
74.	2018/06	The effect of acid pre-treatment on electroplating of gold on titanium substrate (32nd International Conference on Surface Modification Technologies (SMT32))
75.	2018/06	Tri-Axis Fully-Differential MEMS Accelerometer with Segmented Capacitance Detection (Asia-Pacific Conference of Transducers and Micro-Nano Technology 2018 (APCOT 2018))
76.	2018/06	Ultra-high Strength in Electroplated Nanocrystalline Au-Cu Alloys Evaluated by Micro-Compression Tests for MEMS Devices (Taiwan-Japan Joint Symposium (co-organized with the 2018 International Conference on Smart Sensors (ICSS 2018))
77.	2018/05	High-Sensitivity MEMS Inertial Sensor for Medical Applications (The 2nd Taiwan-Japan Joint Symposium in Taiwan, Japan-Taiwan Young Researcher Mini-Workshop)
78.	2018/05	Structure Stability of Electrodeposited Au-Cu Alloy Micro-Cantilever Evaluated By Long-Term Vibration Test for Applications As Movable Components in MEMS Devices (233rd ECS Meeting)
79.	2018/04	Electroplating of Gold on Titanium Substrate: Method to Deposit Defect-Free Film (22nd Topical Meeting of the International Society of Electrochemistry)
80.	2018/04	Pulse Current Electrodeposition of Ultrahigh Strength of Nanocrystalline Au-Cu Alloys (22nd Topical Meeting of the International Society of Electrochemistry)
81.	2018/04	Temperature Characteristics of MEMS Inertial Sensor Fabricated by Gold Multi-Layer Metal Technology (13th Annual IEEE International Conference on Nano-Micro Engineered and Molecular Systems (IEEE NEMS 2018))
82.	2018/03	Enhanced Mechanical Strength of Ti-Au Bi-Layered Micro-Cantilever For MEMS Accelerometers
83.	2017/11	A Novel Tri-Axis MEMS Accelerometer with a Single Au Proof Mass and Fully Differential Sensing Electrodes (The 30th International Microprocesses and Nanotechnology Conference (MNC 2017))
84.	2017/11	Force Response and Vibration Characteristics of Flexible Capacitive Sensors (The 2nd International Symposium on Biomedical Engineering)
85.	2017/11	Long-Term Vibration Test and Structure Stability of Ti/Au Micro-Cantilever as MEMS Components (IUMRS International Conference in Asia (IUMRS-ICA) 2017)
86.	2017/11	Long-Term Vibration Testing of Ti/Au Micro-Cantilever Fabricated by Multi-Layer Metal Technology (2017 MRS Fall Meeting)
87.	2017/11	Material Design of High Strength Electroplated Gold Alloy toward High-Sensitive MEMS Accelerometers (IUMRS International Conference in Asia (IUMRS-ICA) 2017)
88.	2017/11	Mechanical Strengthening of Gold Micro-Cantilever by Control of Electroplating Conditions (IUMRS International Conference in Asia (IUMRS-ICA) 2017)
89.	2017/11	Micro-Mechanical Property Enhancement of Metals Electroplated in Electrolyte Containing Supercritical CO2 (IUMRS International Conference in Asia (IUMRS-ICA) 2017)
90.	2017/11	Strategies of Mechanical Strengthening in Electroplated Au Materials (IUMRS International Conference in Asia (IUMRS-ICA) 2017)
91.	2017/11	Sub-1mG Inertial Sensors by Multi-layer Metal Technology (IUMRS International Conference in Asia (IUMRS-ICA) 2017)
92.	2017/11	Temperature Dependence of Structure Stability of Ti/Au Micro-Cantilever Fabricated by Multi-Layer Metal Technology (2017 MRS Fall Meeting)
93.	2017/11	Temperature Dependence on Package Sealing Ambient of MEMS Sensor Fabricated by Gold Electroplating (The 30th International Microprocesses and Nanotechnology Conference (MNC 2017))
94.	2017/11	Temperature Structure Stability of Multi-Ti/Au-Layered Micro-Cantilever (IUMRS International Conference in Asia (IUMRS-ICA) 2017)
95.	2017/11	Ultrahigh Strength in Electroplated Nanocrystalline Au-Cu Alloys Evaluated by Micro-Compression Tests (2017 MRS Fall Meeting)
96.	2017/11	Vibration Testing of Microfluidic Devices for Cell Analysis: Toward a Chip in Everyday Life (The 2nd International Symposium on Biomedical Engineering)
97.	2017/11	Young’s Modulus Evaluation of Ti/Au Micro-Cantilevers by Au Electrodeposition (IUMRS International Conference in Asia (IUMRS-ICA) 2017)
98.	2017/10	Defect-Free and Uniform Electroplating of Gold on Titanium Surface for Design of MEMS Components (TACT2017 International Thin Films Conference)
99.	2017/09	A Capacitive Sensor Circuit Based on Relaxation Oscillator for Sub-1mG MEMS Inertial Sensors (2017 Int'l Conference on Solid State Devices and Materials (SSDM 2017))
100.	2017/09	A Tri-axis MEMS Accelerometer With a Gold Electroplated Single-proof-mass and Segmented Electrodes (2017 Int'l Conference on Solid State Devices and Materials (SSDM 2017))
101.	2017/09	Effects of Bi-Layered Au/Ti Structure on Mechanical Properties of Micro-Cantilever Evaluated by Micro-Bending Test Toward Applications in MEMS Devices, (43rd Micro and Nano Engineering (MNE2017))
102.	2017/09	Enahnced Bending Strength of Electrodeposited Pure Gold Canrilevers in Micro-Bending Test (43rd Micro and Nano Engineering (MNE2017))
103.	2017/09	Mechanical Property Anisotropy of Pure Gold Evaluated by Micro-compression Test (43rd Micro and Nano Engineering (MNE2017))
104.	2017/09	Structure Stability Enhancement of Gold Micro-Cantilever with a Constrained at Top and Bottom of the Fixed-End (43rd Micro and Nano Engineering (MNE2017))
105.	2017/09	Tilt Characteristics of a MEMS Accelerometer fabricated by Multi-layer Metal Technology (2017 Int'l Conference on Solid State Devices and Materials (SSDM 2017))
106.	2017/07	Electrochemical Plating of Au-Cu Alloy Films for MEMS Sensor Applications (RACI National Centenary Conference)
107.	2017/06	Electroplated Au-based Materials with High Micro-mecchanical Properties as MEMS accelerometer Components (21th International Conference on Solid State Ionics, SSI-21)
108.	2017/06	FEM Simulation on Structure Stability of Ti/Au Multi-Layered Cantilevers with Various Dimensions for Applications as Movable Structures in MEMS Devices (21th International Conference on Solid State Ionics, SSI-21)
109.	2017/06	Long-Term Vibration Characteristics of MEMS Inertial Sensors by Multi-Layer Metal Technology (The 19th Int. Conf. on Solid-State Sensors, Actuators and Microsystems (Transducers 2017))
110.	2017/06	Micro-Mechanical Property Evaluation of Electroplated Au/Cu Alloys toward Applications in MEMS Accelerometers (21th International Conference on Solid State Ionics, SSI-21)
111.	2017/04	A Study on Young’s Modulus of Electroplated Gold Cantilevers for MEMS Devices (12th Annual IEEE Int. Conf. on Nano/Micro Engineered and Molecular Systems (IEEE NEMS 2017))
112.	2017/04	MEMS inertial sensors for biomedical applications (12th Annual IEEE Int. Conf. on Nano/Micro Engineered and Molecular Systems (IEEE NEMS 2017))
113.	2017/04	Preparation and Characterization of Au-Cu Alloy Films for MEMS Accelerometer (21st Topical Meeting of the International Society of Electrochemistry)
114.	2016/11	A Study on Flexible Tactile Sensor for Assistance Robots (International Symposium on Biomedical Engineering)
115.	2016/11	Young’s modulus evaluation of electroplated Ti/Au structures for MEMS devices (29th International Microprocesses and Nanotechnology Conference (MNC 2016))
116.	2016/10	A Damping Constant Model for Proof-Mass Structure Design of MEMS Inertial Sensor by Multi-Layer Metal Technology (IEEE Sensors 2016)
117.	2016/10	Fine Grained Au Films with Controllable Mechanical Strength by Pulse Plating (The 2016 PRiME Meeting)
118.	2016/09	A Novel Noise Analysis Method with Multi-physics Simulation for Capacitive CMOS-MEMS Inertial Sensor System (2016 Int. Conf. on Solid State Devices and Materials (SSDM 2016))
119.	2016/09	A Spring Design for Tri-axis MEMS Accelerometer by Multi-layer Metal Technology (2016 Int. Conf. on Solid State Devices and Materials (SSDM 2016))
120.	2016/09	Controllable Mechanical Properties of Au Films by Pulse Electroplating for MEMS Accelerometer (42nd Micro and Nano Engineering (MNE2016))
121.	2016/09	Development of High Sensitivity CMOS-MEMS Inertia Sensor and its Application to Early-Stage Diagnosis of Parkinson's Disease (the 46th European Solid-State Device Re-search Conference (ESSDERC))
122.	2016/09	Enhanced mechanical property of metallic films with supercritical carbon dioxide for micro-electrical-mechanical system accelerometer (The 15th Symposium on Development of Supercritical Fluid Technology and Application and The 2nd International Workshop on Supercritical Fluid Dyeing Technology)
123.	2016/09	Enhancement of Mechanical Properties in Au Films Electroplated with Supercritical Carbon Dioxide (42nd Micro and Nano Engineering (MNE2016))
124.	2016/09	High Mechanical Strength in Gold Films Electroplated with Supercritical Carbon Dioxide for MEMS Applications
125.	2016/09	High Strength Au film Fabricated by Advanced Electrochemical Technique in Supercritical CO2 Emulsified Electrolyte for MEMS Accelerometers (2nd International Conference and Expo on Separation Techniques)
126.	2016/09	Mechanical Behaviour of Electroplated Gold Evaluated by Micro-Tensile Test for Application in MEMS Accelerometer (42nd Micro and Nano Engineering (MNE2016))
127.	2016/09	Micro-Bending Tests of Pure Gold Cantilevers for Applications as Movable Components in MEMS Devices (42nd Micro and Nano Engineering (MNE2016))
128.	2016/07	Electrodeposited Gold for Next Generation MEMS Accelerometer Toward Medical Applications (Integrative Biology-2016)
129.	2016/06	A Novel MEMS Inertial Sensor With Out-of-plane Differential Sensing Structure By Multi-layer Metal Technology (Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT 2016))
130.	2016/05	A 1-mG MEMS Senso (229th ECS Meeting)
131.	2016/05	A Study of Railroad Vehicle Control by Inertial Sensors (11th World Congress on Railway Research)
132.	2016/05	Pulse Electroplating of Au Films with Ultra High Strength (229th ECS Meeting)
133.	2016/04	A Design of Spring Constant Arranged for MEMS Accelerometer by Multi-layer Metal Technology (IEEE NEMS 2016)
134.	2016/04	Electroplated Gold Materials with Enhanced Mechanical Strength by Multi-Layered Structure (ISE - Topical Meeting)
135.	2016/04	Mechanical Characteristics of Structure Stability with Ti/Au Micro-Cantilevers Formed by Au Electroplating (ISE - Topical Meeting)
136.	2016/04	Preparation and Characterization of Gold Films by Electroplating with Supercritical Carbon Dioxide (ISE - Topical Meeting)
137.	2016/04	Pulse Electroplating of Ultra-Fine Grained Au Films with High Strength for Micro-Electrical-Mechanical System Devices (ISE - Topical Meeting)
138.	2016/04	Study of Gold Electroplating by Constant and Pulse Current Method with Non-Cyanide Gold Sulfite Electrolyte (ISE - Topical Meeting)
139.	2016/03	Application of Supercritical Carbon Dioxide in Electroplating of Gold Materials Used in MEMS Devices
140.	2016/02	A MEMS Inertia Sensor with Brownian Noise of Below 50 nG/Hz^1/2 by Multi-Layer Metal Technology (IEEE Inertial Sensors 2016)
141.	2015/11	A Sub-1G CMOS-MEMS Accelerometer (IEEE Sensors 2015)
142.	2015/11	Micro-Mechanical Properties of Electrodeposited Gold Thin Films (TACT 2015 International Thin Films Conference)
143.	2015/09	A Low Mechanical Noise Tri-axis MEMS Ineretial Sensor Fabricated by Multi-layered Metal Technology (41st Micro and Nano Engineering (MNE2015))
144.	2015/09	A Study on Mechanical Structure of a MEMS Accelerometer Fabricated by Multi-layer Metal Technology (32nd Advanced Metallization Conference (AMC2015))
145.	2015/09	A Study on Mechanical Structure of a MEMS Accelerometer Fabricated by Multi-layer Metal Technology (25th Advanced Metallization Conference Asian Session (ADMETAplus2015))
146.	2015/09	High Mechanical Strength Gold Micro-Components Fabricated by Pulse Electroplating (41st Micro and Nano Engineering (MNE2015))
147.	2015/09	Mechanical Properties of Electrodeposited Gold for MEMS Device (2015 International Conference on Solid State Devices and Materials (SSDM 2015))
148.	2015/09	Novel Gain-Controlled Sensor Circuits Designed by Multi-physics Simulation for CMOS-MEMS Accelerometer (2015 International Conference on Solid State Devices and Materials (SSDM 2015))
149.	2015/09	Robustness of Integrated Stoppers for MEMS Accelerometer Fabricated by Multi-layered Metal Technology (2015 International Conference on Solid State Devices and Materials (SSDM 2015))
150.	2015/09	Sample Size Effect on Mechanical Properties of Electrodeposited Gold Evaluated by Micro-Compression Test (41st Micro and Nano Engineering (MNE2015))
151.	2015/09	Structure Stability of High Aspect Ratio Ti/Au Two-Layered Cantilevers for Applications in MEMS Accelerometers (41st Micro and Nano Engineering (MNE2015))
152.	2015/09	Study on Ti/Au Two-Layered Cantilevers with Different Aspect Ratio for MEMS Devices (2015 International Conference on Solid State Devices and Materials (SSDM 2015))
153.	2015/08	A Sub-1G MEMS Inertial Sensor (International Symposium for Advanced Materials Research (ISAMR 2015))
154.	2015/08	Compression Deformation of Micro-components Fabricated by FIB from Gold Electrodeposited Films (International Symposium for Advanced Materials Research (ISAMR 2015))
155.	2015/08	Nano-G metrology system and its biomedical applications by CMOS-MEMS technology (3rd International Conference on Integrative Biology)
156.	2015/06	Stability of Movable Structure Formed by Au Electroplating for MEMS Devices (8th Int. Conf. on Materials for Advanced Technologies (ICMAT 2015))
157.	2015/05	A Sub-1G MEMS Sensor (the 227th ECS Meeting)
158.	2015/04	CMOS -MEMS -New Frontier of Multilevel Interconnect Technology- (2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC 2015))
159.	2014/11	A 1mG-to-20G Integrated MEMS Inertial Sensor (IEEE SENSORS 2014)
160.	2014/11	A MEMS Energy Harvesting Device for Integrated CMOS-MEMS Technology (27th Int. Microprocesses and Nanotechnology Conference (MNC 2014))
161.	2014/11	MEMS for sensing sub-1G (The First Joint Workshop on Electrical Engineering between Tokyo Tech & KAIST)
162.	2014/09	A Novel Electromechanical Model of a MEMS Energy Harvesting Device for a Multi-physics Simulation Platform on a Circuit Simulator (Int. Conf. on Solid-State Devices and Materials (SSDM 2014))
163.	2014/09	A Sub-1G Tri-axis MEMS Capacitive Sensor for Integrated CMOS-MEMS Accelerometers (Int. Conf. on Solid-State Devices and Materials (SSDM 2014))
164.	2014/06	2.3 pJ/bit Frequency-Stable Impulse OOK Transmitter Powered Directly by an RF Energy Harvesting Circuit with -19.5 dBm Sensitivity (IEEE Radio Frequency Integrated Circuits Symposium)
165.	2014/06	A Sub-1G Capacitive Sensor for Integrated CMOS-MEMS Accelerometers (7th Asia-Pacific Conference on Transducers and Micro/Nano Technologies (APCOT2014))
166.	2014/05	A Tri-Axis MEMS Capacitive Sensor Using Multi-Layered High-density Metal for an Integrated CMOS-MEMS Accelerometer (2014 IEEE International Interconnect Technology Conference/Advanced Metallization Conference (IITC/AMC 2014))
167.	2014/05	Integrated CMOS-MEMS Technology and its Application (the 225th Meeting of the Electrochemical Society (The 2nd More-than-Moore Symposium))
168.	2014/04	A Dual-Axis MEMS Inertial Sensor Using Multi-Layered High-density Metal for an Arrayed CMOS-MEMS Accelerometer (Symp. on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP2014))
169.	2013/11	Sub-1G MEMS Accelerometer (IEEE SENSORS 2013)
170.	2013/09	An 8-ch, 20-V Output CMOS Switching Driver with 3.3-V Power Supply for Integrated MEMS Devices Controlling (Int. Conf. on Solid State Devices and Materials (SSDM 2013))
171.	2013/09	Novel Sensor Circuits Design Using Multi-physics Simulation for CMOS-MEMS Technology (Int. Conf. on Solid State Devices and Materials (SSDM 2013))
172.	2013/06	AN ARRAYED MEMS ACCELEROMETER WITH A WIDE RANGE OF DETECTION (17th Int. Conf on Solid-State Sensors, Actuators and Microsystems (Transducers 2013))
173.	2012/10	Evaluation of a Capacitive Sensor with a Gold Proof Mass Toward Integrated CMOS-MEMS Accelerometers (25th Int. Microprocesses and Nanotechnology Conference (MNC 2012))
174.	2012/09	A CMOS-MEMS Design Technique based on an Electrical Circuit Simulator with Hardware Description Language (2012 Int. Conf. on Solid State Devices and Materials (SSDM 2012))
175.	2012/09	A Novel Sensor Structure and its Fabrication Process for Integrated CMOS-MEMS Accelerometer (2012 Int. Conf. on Solid State Devices and Materials (SSDM 2012))
176.	2012/08	Real-Time Monitoring of Photothermal Porated Mammalian Cells by Electric Impedance Sensors (IEEE International Conference on Optical MEMS & Nanophotonics)
177.	2011/04	Monolithic integration of passive RF components by MEMS (IEEE 2011 International Symposium on VLSI Design, Automation and Test (VLSI-DAT))
178.	2010/07	A Ku-Band RF-MEMS Phase Shifter with SOI Double-Side Bulk-Micromachining Design (5th Asia-Pacific Conference on Transducers and Micro-Nano Technology (APCOT))
179.	2010/01	Development of a Dual-SPDT RF-MEMS Switch for Ku-band (IEEE Radio and Wireless Symposium (RWS))
180.	2009/12	A Dual-SPDT RF-MEMS Switch on a Small-Sized LTCC Phase Shifter for Ku-band operation (Asia-Pacific Microwave Conference (APMC))
181.	2009/10	A Loaded-Line Phase Shifter Using MEMS Switches
182.	2009/08	A Prototype of Ku-Band Small-Sized LTCC Phase Shifter with RF-MEMS Switches (2009 Thailand-Japan MicroWave (TJMW2009))
183.	2009/01	A 12-GHz DPDT RF MEMS Switch with Layer-wise Waveguide/Actuator Design Technique (IEEE MEMS2009)
184.	2009/01	Development of Multi-user Multi-chip SOI CMOS-MEMS Process (IEEE MEMS2009)
185.	2008/10	A Phase Shifter by LTCC Substrate with an RF-MEMS Switch (The 38th European Microwave Conference (EuMC))
186.	2008/09	Modelling and Design Guidelines of Metamaterial-based Artificial Dielectric for the Miniaturization of Microwave Passive Circuit (Metamaterials' 2008)
187.	2007/12	Microwave Switches by MEMS Technology and their Application to Phase-Shifter (Second Japan-Taiwan Workshop on Future Frequency Control Devices)
188.	2007/11	RF-MEMS Switches for 5.8 GHz Phase Shifter Application (Int. Workshop on Piezo-devices based on Latest MEMS Technologies)
189.	2006/07	Stabilization of mode-locked fiber lasers using Bismuth-oxide-based highly nonlinear fiber (Topical Meeting on Optical Amplifiers and Their Applications (OAA 2006))