研究者学術情報データベース

ヤマネ　ダイスケ
山根　大輔
YAMANE DAISUKE

所属理工学部機械工学科

職名准教授

論文
1.	2023/07	Demonstration of Non-Contact Out-of-Plane Vibration Energy Harvesting using an Electric-Double-Layer Electret │ IEEJ Transactions on Electrical and Electronic Engineering │ (共著)
2.	2022/09/05	IoT電源とEMC　IoT電源への期待　環境振動発電素子の小型化・高出力化とEMC │ 電磁環境工学情報EMC │ 35 (5),111-116頁 (共著)
3.	2022/05/24	Bandwidth Broadening of MEMS Vibration Energy Harvesters by Voltage-boost Rectifier Circuit │ Sensors and Materials │ 34 (5),1889-1897頁 (共著)
4.	2022/05/24	Contactless Electrostatic Vibration Energy Harvesting using Electric Double Layer Electrets │ Sensors and Materials │ 34 (5),1869-1877頁 (共著)
5.	2022/04/25	Effect of current density on micro-mechanical property of electrodeposited gold film evaluated by micro-compression │ Surface and Coating Technology │ 436,128315 (共著)
6.	2022/04/13	Electrodeposition and Micro-Mechanical Property Characterization of Nickel–Cobalt Alloys toward Design of MEMS Components │ Electrochem │ 3,198-210頁 (共著)
7.	2022/04/10	荷電処理不要の静電型MEMS振動発電素子 │ クリーンエネルギー │ 31 (4),35-40頁 (共著)
8.	2021/12/20	MEMS post-processed self-assembled electret for vibratory energy harvesters │ Applied Physics Letters │ 119,254102-1-254102-7頁 (共著)
9.	2021/07	低閾値整流昇圧回路を用いた非定常振動下における振動発電 │ 電気学会論文誌E（センサ・マイクロマシン部門誌） │ 141 (7),282-232頁 (共著)
10.	2021/04/08	Effective Young’s Modulus of Complex Three Dimensional Multilayered Ti/Au Micro-Cantilevers Fabricated by Electrodeposition and the Temperature Dependency │ Electrochem │ 2 (2),216-223頁 (共著)
11.	2021/03/01	Development and Characterization of Vertically Stacked Tactile Sensor with Hollow Structure │ IEEE Sensors Journal │ 21 (5),5809-5818頁 (共著)
12.	2020/12/24	Electrodeposition of Ni-Co Alloys and Their Mechanical Properties by Micro-Vickers Hardness Test │ Electrochem │ 2 (1),1-9頁 (共著)
13.	2020/11/01	Co-Electrodeposition of Au-TiO2 Nanocomposite and the Micro-Mechanical Properties │ Electrochem │ 1 (4),388-393頁 (共著)
14.	2020/06/05	Sample geometry effect on mechanical property of gold micro-cantilevers by micro-bending test │ MRS Communications │ 10 (3),434-438頁 (共著)
15.	2020/05	CMOS-MEMS Based Microgravity Sensor and Its Application │ ECS Transactions │ 97 (5),91 (共著)
16.	2020/04	Alloy Electroplating and Young’s Modulus Characterization of AuCu Alloy Microcantilevers │ Journal of The Electrochemical Society │ 167,082503 (共著)
17.	2019/11	A Voltage-Boost Rectifier Circuit for Energy Harvesting from Environmental Vibrations │ Journal of Physics: Conference Series │ 1407,012101 1-4 (共著)
18.	2019/09	Nanoscale Hierarchical Structure of Twins in Nanograins Embedded with Twins and the Strengthening Effect │ Metals │ 9 (9),987-1 - 987-9 (共著)
19.	2019/07	Cu-Alloying Effect on Structure Stability of Electrodeposited Gold-Based Micro-Cantilever Evaluated by Long-Term Vibration Test │ Microelectronic Engineering │ 215,111001-1 - 111001-4 (共著)
20.	2019/07	Five-fold sensitivity enhancement in a capacitive tactile sensor by reducing material and structural rigidity │ Sensors & Actuators: A. Physical │ 293,167-177 (共著)
21.	2019/07	High Strength Electrodeposited Au-Cu Alloys Evaluated by Bending Test toward Movable Micro-Components │ ECS Journal of Solid State Science and Technology │ 8 (8),412-415 (共著)
22.	2019/05	Strengthening of micro-cantilever by Au/Ti bi-layered structure evaluated by micro-bending test toward MEMS devices │ Microelectronic Engineering │ 213,13-17 (共著)
23.	2019/02	Long-term structure stability of Ti/Au layered micro-cantilever evaluated by vibration test │ Microelectronic Engineering │ 207,33-36 (共著)
24.	2019	A MEMS Accelerometer for Sub-mG Sensing │ Sensors and Materials │ 31 (9),2883-2894 (共著)
25.	2018/04	Promoted bending strength in micro-cantilevers composed of nanograined gold toward MEMS applications │ Microelectronic Engineering │ 195,20-24 (共著)
26.	2018/02	Sample size effect on micro-mechanical properties of gold electroplated with dense carbon dioxide │ Elsevier Surface and Coatings Technology │ 350,1065-1070 (共著)
27.	2018	A 0.18-μm CMOS Time-Domain Capacitive-Sensor Interface for Sub-1mG MEMS Accelerometers │ IEICE Electronics Express (ELEX) │ 15 (2),20171227 (共著)
28.	2018	Au-Cu Alloys Prepared by Pulse Electrodeposition toward Applications as Movable Micro-Components in Electronic Devices │ Journal of The Electrochemical Society │ 165,D58-D63 (共著)
29.	2018	Enhancement in Structure Stability of Gold Micro-Cantilever by Constraints at the Fixed-End for Applications as Movable Structures of MEMS │ Microelectronics Engineering │ 187-188,105-109 (共著)
30.	2018	Microgravity Generation Using Tilting Board for Resolution Evaluation of MEMS Accelerometer │ Sensors and Materials │ 30 (12),2919-2926 (共著)
31.	2017/09	Deformation behavior of electroplated gold composed of nano-columnar grains embedded in micro-columnar textures │ Materials Letters │ 202,82-85 (共著)
32.	2017/08	Micro-Bending Testing of Electrodeposited Gold for Applications as Movable Components in MEMS Devices │ Microelectronics Engineering │ 180,15-19 (共著)
33.	2017/04	Tensile Tests of Micro-Specimens Made of Electroplated Gold │ Microelectronics Engineering │ 174,6-10 (共著)
34.	2017/02	High-Strength Electroplated Au-Cu Alloys as Micro-components in MEMS Devices │ Journal of The Electrochemical Society │ 164 (4),D244-D247 (共著)
35.	2016/11	Enhancement of Mechanical Strength in Au Films Electroplated with Supercritical Carbon Dioxide │ Electrochemistry Communications │ 72,126-130 (共著)
36.	2016/11	Evaluation and Modeling of Adhesion Layer in Shock-Protection Structure for MEMS Accelerometer │ Microelectronics Reliability │ 66,78-84 (共著)
37.	2016	A 1-mG MEMS Sensor │ ECS Transactions │ 72 (3),7-14 (共著)
38.	2016	A Dual-Axis MEMS Capacitive Inertial Sensor with High-Density Proof Mass │ Microsystem Technologies │ 22,459-464 (共著)
39.	2016	Brittle Fracture of Electrodeposited Gold Observed by Micro-Compression │ Materials Transactions │ 57 (8),1257-1260 (共著)
40.	2016	Pulse Electroplating of Ultra-Fine Grained Au Films with High Compressive Strength │ Electrochemistry Communications │ 67,51-54 (共著)
41.	2016	Structure Stability of High Aspect Ratio Ti/Au Two-Layer Cantilevers for Applications in MEMS Accelerometers │ Microelectronics Engineering │ 159,90-93 (共著)
42.	2015/04	高感度静電容量型センサにおけるBrownian Noise評価手法 │ 電気学会論文誌E（センサ・マイクロマシン部門誌） │ 135 (4),142-143 (共著)
43.	2015	A 0.1G-to-20G Integrated MEMS Inertial Sensor │ Japanese Journal of Applied Physics │ 54 (8),087202.1-087202.4 (共著)
44.	2015	A Sub-1G MEMS Sensor │ ECS Transactions │ 66 (5),131-138 (共著)
45.	2014/02	Design of sub-1g microelectromechanical systems accelerometers │ Applied Physics Letters │ 104 (7),074102 (共著)
46.	2014/02	Electrical impedance monitoring of photothermal porated mammalian cells │ Journal of Laboratory Automation │ 19 (1),50-59 (共著)
47.	2014/01	水平駆動型MEMS導波路の静電駆動時における高周波特性の評価手法 │ 電子情報通信学会論文誌C(エレクトロニクスソサエティ) │ J97-C (1),37-45 (共著)
48.	2014	A capacitive CMOS-MEMS sensor designed by multi-physics simulation for integrated CMOS-MEMS technology │ Japanese Journal of Applied Physics │ 53,04EE15.1-7 (共著)
49.	2014	An 8 channel, 20 V output CMOS switching driver with 3.3 V power supply using triple-well biasing techniques for integrated MEMS device control │ Japanese Journal of Applied Physics │ 53,04EE13.1-8 (共著)
50.	2014	An arrayed accelerometer device of a wide range of detection for integrated CMOS-MEMS technology │ Japanese Journal of Applied Physics │ 53 (027202),027202-1 - 027202-9 (共著)
51.	2014	Integrated CMOS-MEMS Technology and Its Applications │ ECS Transactions │ 61 (6),21-39 (共著)
52.	2013/06	Novel Sensor Structure and its Evaluation for Integratd Complementary Metal Oxide Semiconductor Microelectromechanical Systems Accelerometer │ Japanese Journal of Applied Physics │ 52 (6),06GL04 (共著)
53.	2012/10	エア分離CPWによるシリコン導波路の基礎検討とKu帯RF-MEMSスイッチへの応用 │ 電子情報通信学会論文誌C（エレクトロニクスソサエティ) │ J95-C (10),219-227 (共著)
54.	2011/10	A Ku-band Dual-SPDT RF-MEMS Switch by Double-Side SOI Bulk Micromachining │ IEEE Journal of Microelectromechanical Systems │ 20 (5),1211-1221 (共著)
55.	2011/03	メッキ金の厚膜マスクによるRF-MEMSコプレーナ導波路の製作 │ 電気学会論文誌E（センサ・マイクロマシン部門誌） │ 131 (3),130-131 (共著)
56.	2010/12	A 12GHz bulk-micromachined RF-MEMS phase shifter by SOI layer-separation design │ IEICE Electronics Express │ 7 (24),1785-1789 (共著)
57.	2010/01	An SOI bulk-micromachined dual SPDT RF-MEMS switch by layer-wise separation design of waveguide and switching mechanism │ IEICE Electronics Express │ 7 (2),80-85 (共著)