Researcher Database

（Last updated : 2026-03-10 13:58:13）　

MURATA Junji

Department / Course College of Science and Engineering Department of Mechanical Engineering

Title / Position Professor

Click to view the Scopus page. The data was downloaded from Scopus API on Sep 01, 2025. via http://api.elsevier.com and http://www.scopus.com .

Other Affiliations
1.	Graduate School of Science and Engineering

Academic background
1.	～2010/03	Doctoral Program (2nd Semester) │ Department of precision science and technology │ Graduate school of engineering │ Osaka University │ Completed Ph. D in engineering
2.	～2005/03	Department of precision science and technology │ Faculty of Engineering │ Osaka University │ Graduated

Business career
1.	2023/04/01	Professor │ │

Research activities
1.		The Japan society for precision engineering

Subject of research
1.	Development of functional particles for precision machining
2.	Liquid electrolyte free electrochemical machining using solid polymer electrolyte
3.	Photo-enhanced electrochemical polishing for semiconductor surfaces

Research summary
Ultra-precision surface processing utilizing physical/chemical reaction Surface processing for functional materials such as semiconductors, ceramics and optical materials is essential to achieve high-performance electronic/optical devices. However, owing to their high mechanical hardness and chemical stability, such materials are generally difficult to be processed by conventional surface machining method. In our research, novel surface preparation methods are developed utilizing physical/chemical reactions occurred on the material surface. The physical/chemical reaction including electrochemical, tribo-chemical, and catalyst-enhanced chemical reaction are employed to remove material surface with an atomic/molecular level accuracy, and thus the ultra-precision machined surface can be obtained. Furthermore, functional particles such as multi-component magnetic particles, SPE (solid polymer electrolyte)-coated particles are also developed to polish or etch material surfaces with nano/micro accuracy. By developing new processing methods that offer superior efficiency and accuracy to the conventional machining method, we can contribute to a promotion of the energy-saving and environment-friendly society.

Present specialized field
Thin film/Surface and interfacial physical properties, Production engineering/ Processing studies (Keyword：Precision machining, polishing, non-conventional machining)

Papers
1.	2026/02/26	Fluorocarbon-Free Hierarchical Slippery Copper Surfaces via Solid-State Electrochemical Etching │ ACS Applied Materials & Interfaces │
2.	2026/01	Liquid-free electrochemical approach for direct patterning of ITO films with polymer electrolyte stamps for flexible transparent electrodes │ Applied Surface Science │ 716,pp.164674
3.	2025/10	Review of physicochemical-assisted nanomanufacturing processes for wide-bandgap semiconductor wafers │ International Journal of Machine Tools and Manufacture │ ,pp.104321-104321
4.	2025/08	Maskless soft lithography for fabricating micro- and nano-scale Ag structures via solid-state electrochemical etching using a polymer electrolyte membrane for optoelectronic and sensing applications │ Materials Advances │ (16),pp.5424-5438
5.	2025/02/27	Soft Copper Nanoimprinting via Solid-State Electrochemical Etching for Flexible Optoelectronics │ ACS Applied Materials & Interfaces │ 17 (14),pp.21929-21939
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Academic conference presentation
1.	2025/11/06	Solid-State Electrochemical Soft Imprint for Direct Copper Nanopatterning In Optoelectronic Applications
2.	2025/11/05	Maskless Soft Lithography For Fabricating Micro- And Nanoscale Ag Structures Via Solid-State Electrochemical Etching Using A Polymer Electrolyte Membrane
3.	2025/11/05	Micro- And Nanoscale Patterning OfIto Films By Solid-State Electrochemical Reduction Using Polymer Electrolyte Membrane
4.	2025/02/01	Solid-State Electrochemical Imprinting with Polymer Electrolyte Membrane Stamps for Functional Microstructure on Copper Surface
5.	2025/01/31	All solid phase pattern electroplating for forming patterned Cu thin film using polymer electrolyte membrane stamp
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Winning science prize
1.	2009/11	JSPE prize best paper award (3rd International Conference of Asian Society for Precision Engineerign and Nanotechnology)

Acquisition patent
1.		Catalyst-aided chemical processing method and apparatus （US Pat. 7651625）