Researcher Database

（Last updated : 2024-12-23 16:09:56）　

MURATA Junji

Department / Course College of Science and Engineering Department of Mechanical Engineering

Title / Position Professor

Scopus Paper Info
Paper Count: 68 Citation: 1118 h-index: 19

Click to view the Scopus page. The data was downloaded from Scopus API on Mar 24, 2025. via http://api.elsevier.com and http://www.scopus.com .

Achievement
- Other Affiliations
Profile
research
teaching
- Subject
- Teaching achievements
social activity
- Activity in society
- Research exchange preferred theme
Others

Other Affiliations
1.	Graduate School of Science and Engineering
2.	Research Organization of Science and Technology Research Center of Advanced Materials

Other Affiliations

Graduate School of Science and Engineering

Research Organization of Science and Technology Research Center of Advanced Materials

Academic background
1.	～2010/03	Doctoral Program (2nd Semester) │ Department of precision science and technology │ Graduate school of engineering │ Osaka University │ Completed Ph. D in engineering
2.	～2005/03	Department of precision science and technology │ Faculty of Engineering │ Osaka University │ Graduated

Academic background

～2010/03

Doctoral Program (2nd Semester) │ Department of precision science and technology │ Graduate school of engineering │ Osaka University │ Completed Ph. D in engineering

～2005/03

Department of precision science and technology │ Faculty of Engineering │ Osaka University │ Graduated

Research activities
1.		The Japan society for precision engineering

Research activities

The Japan society for precision engineering

Subject of research
1.	Development of functional particles for precision machining
2.	Liquid electrolyte free electrochemical machining using solid polymer electrolyte
3.	Photo-enhanced electrochemical polishing for semiconductor surfaces

Subject of research

Development of functional particles for precision machining

Liquid electrolyte free electrochemical machining using solid polymer electrolyte

Photo-enhanced electrochemical polishing for semiconductor surfaces

Research summary
Ultra-precision surface processing utilizing physical/chemical reaction Surface processing for functional materials such as semiconductors, ceramics and optical materials is essential to achieve high-performance electronic/optical devices. However, owing to their high mechanical hardness and chemical stability, such materials are generally difficult to be processed by conventional surface machining method. In our research, novel surface preparation methods are developed utilizing physical/chemical reactions occurred on the material surface. The physical/chemical reaction including electrochemical, tribo-chemical, and catalyst-enhanced chemical reaction are employed to remove material surface with an atomic/molecular level accuracy, and thus the ultra-precision machined surface can be obtained. Furthermore, functional particles such as multi-component magnetic particles, SPE (solid polymer electrolyte)-coated particles are also developed to polish or etch material surfaces with nano/micro accuracy. By developing new processing methods that offer superior efficiency and accuracy to the conventional machining method, we can contribute to a promotion of the energy-saving and environment-friendly society.

Research summary

Ultra-precision surface processing utilizing physical/chemical reaction

Surface processing for functional materials such as semiconductors, ceramics and optical materials is essential to achieve high-performance electronic/optical devices. However, owing to their high mechanical hardness and chemical stability, such materials are generally difficult to be processed by conventional surface machining method. In our research, novel surface preparation methods are developed utilizing physical/chemical reactions occurred on the material surface. The physical/chemical reaction including electrochemical, tribo-chemical, and catalyst-enhanced chemical reaction are employed to remove material surface with an atomic/molecular level accuracy, and thus the ultra-precision machined surface can be obtained. Furthermore, functional particles such as multi-component magnetic particles, SPE (solid polymer electrolyte)-coated particles are also developed to polish or etch material surfaces with nano/micro accuracy. By developing new processing methods that offer superior efficiency and accuracy to the conventional machining method, we can contribute to a promotion of the energy-saving and environment-friendly society.

Present specialized field
Thin film/Surface and interfacial physical properties, Production engineering/ Processing studies (Keyword：Precision machining, polishing, non-conventional machining)

Present specialized field

Thin film/Surface and interfacial physical properties, Production engineering/ Processing studies (Keyword：Precision machining, polishing, non-conventional machining)

Papers
1.	2024/09/24	Solid-state electrochemical oxidation with polyelectrolyte membrane stamps for micro-/nanoscale pattern formation on Au surfaces │
2.	2024/08/15	Sustainable Electrochemical Mechanical Polishing (ECMP) for 4H-SiC wafer using chemical-free polishing slurry with hydrocarbon-based solid polymer electrolyte │ Applied Surface Science │
3.	2024/03/01	Ultrafast Solid-State Electrochemical Imprinting Utilizing Polymer Electrolyte Membrane Stamps for Static/Dynamic Structural Coloration and Letter Encryption │ Small Methods │
4.	2024/01/17	Cu Direct Nanopatterning Using Solid-State Electrochemical Dissolution at the Anode/Polymer Electrolyte Membrane Interface │ Advanced Materials Interface │
5.	2023/07	Environment-friendly electrochemical mechanical polishing using solid polymer electrolyte/CeO2 composite pad for highly efficient finishing of 4H-SiC (0001) surface │ Applied Surface Science │ 625,pp.157190
Display All（47）

Papers

2024/09/24

Solid-state electrochemical oxidation with polyelectrolyte membrane stamps for micro-/nanoscale pattern formation on Au surfaces │

2024/08/15

Sustainable Electrochemical Mechanical Polishing (ECMP) for 4H-SiC wafer using chemical-free polishing slurry with hydrocarbon-based solid polymer electrolyte │ Applied Surface Science │

2024/03/01

Ultrafast Solid-State Electrochemical Imprinting Utilizing Polymer Electrolyte Membrane Stamps for Static/Dynamic Structural Coloration and Letter Encryption │ Small Methods │

2024/01/17

Cu Direct Nanopatterning Using Solid-State Electrochemical Dissolution at the Anode/Polymer Electrolyte Membrane Interface │ Advanced Materials Interface │

2023/07

Environment-friendly electrochemical mechanical polishing using solid polymer electrolyte/CeO2 composite pad for highly efficient finishing of 4H-SiC (0001) surface │ Applied Surface Science │ 625,pp.157190

Display All（47）